JPH0723863Y2 - 温度ヒューズ - Google Patents
温度ヒューズInfo
- Publication number
- JPH0723863Y2 JPH0723863Y2 JP1779688U JP1779688U JPH0723863Y2 JP H0723863 Y2 JPH0723863 Y2 JP H0723863Y2 JP 1779688 U JP1779688 U JP 1779688U JP 1779688 U JP1779688 U JP 1779688U JP H0723863 Y2 JPH0723863 Y2 JP H0723863Y2
- Authority
- JP
- Japan
- Prior art keywords
- low
- melting point
- melting
- point metal
- metal body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000002844 melting Methods 0.000 claims description 58
- 230000008018 melting Effects 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 48
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1779688U JPH0723863Y2 (ja) | 1988-02-12 | 1988-02-12 | 温度ヒューズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1779688U JPH0723863Y2 (ja) | 1988-02-12 | 1988-02-12 | 温度ヒューズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01122240U JPH01122240U (en]) | 1989-08-18 |
| JPH0723863Y2 true JPH0723863Y2 (ja) | 1995-05-31 |
Family
ID=31231892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1779688U Expired - Lifetime JPH0723863Y2 (ja) | 1988-02-12 | 1988-02-12 | 温度ヒューズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723863Y2 (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010123277A3 (en) * | 2009-04-21 | 2011-01-27 | Smart Electronics Inc. | Thermal fuse resistor, manufacturing method thereof, and installation method thereof |
| WO2010123276A3 (en) * | 2009-04-21 | 2011-02-03 | Smart Electronics Inc. | Thermal fuse resistor |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008311161A (ja) * | 2007-06-18 | 2008-12-25 | Sony Chemical & Information Device Corp | 保護素子 |
| JP4663760B2 (ja) * | 2007-08-20 | 2011-04-06 | 内橋エステック株式会社 | 二次電池用保護回路 |
| JP2010165685A (ja) * | 2010-03-04 | 2010-07-29 | Sony Chemical & Information Device Corp | 保護素子及びバッテリーパック |
| JP5590966B2 (ja) * | 2010-05-28 | 2014-09-17 | 京セラ株式会社 | ヒューズ装置および回路基板 |
| JP2014044955A (ja) * | 2013-10-01 | 2014-03-13 | Dexerials Corp | 保護素子及びバッテリーパック |
-
1988
- 1988-02-12 JP JP1779688U patent/JPH0723863Y2/ja not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010123277A3 (en) * | 2009-04-21 | 2011-01-27 | Smart Electronics Inc. | Thermal fuse resistor, manufacturing method thereof, and installation method thereof |
| WO2010123276A3 (en) * | 2009-04-21 | 2011-02-03 | Smart Electronics Inc. | Thermal fuse resistor |
| US8400252B2 (en) | 2009-04-21 | 2013-03-19 | Smart Electronics Inc. | Thermal fuse resistor |
| US8400253B2 (en) | 2009-04-21 | 2013-03-19 | Smart Electronics Inc. | Thermal fuse resistor, manufacturing method thereof, and installation method thereof |
| DE112010001694B4 (de) * | 2009-04-21 | 2013-08-01 | Smart Electronics, Inc. | Schmelzwiderstand |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01122240U (en]) | 1989-08-18 |
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